Extremely thin films of dielectrics and other materials play vital roles in many types of advanced microelectronics, but their tiny dimensions and atomic make-up can impair mechanical performance.
Now, researchers at the NSF STROBE Science and Technology Center in the U.S. have shown they can characterize the mechanical properties of silicon-carbide films as thin as 5 nm using tabletop sources of extreme ultraviolet laser light—showing them to be far softer than thicker films of the same material (Phys. Rev. Mater., doi: 10.1103/PhysRevMaterials.4.073603).